JOINHANDS Part No.XY-CR0603LGAJ52
0603 Chip led
Features
1.6mmⅹ0.8mm SMD LED, 0.6mm thickness
Low power consumption
Wide view angle
Package: 4000pcs/reel
RoHS Compliant
Applications
Ideal for back light and indicator
Various colors and lens types available
Package outlines Recommend Pad Layout
Electro-Optical Characteristics (Ta=25℃)
Parameter | Test Condition | Symbol | Value | Unit |
Min | Typ | Max |
Wavelength at peak emission | If=20mA | λp | -- | 520 | -- | nm |
Spectral half bandwidth | If=20mA | △λ | -- | 35 | -- | nm |
Dominant wavelength | If=20mA | λd | 500 | -- | 530 | nm |
Forward voltage | If=20mA | Vf | 2.8 | -- | 3.6 | V |
Luminous intensity | If=20mA | Iv | 320 | 550 | 800 | mcd |
Viewing angle at 50% Iv | If=10mA | 2θ1/2 | -- | 120 | -- | Deg |
Reverse current | Vr=5V | Ir | -- | -- | 10 | mA |
Reflow Profile
n Reflow Temp/Time
Notes:
1. We recommend the reflow temperature 245℃ (±5℃).The maximum soldering temperature should be limited to 260℃.
2.Don’t cause stress to the epoxy resin while it is exposed to high temperature.
3.Number of reflow process shall be 2 times or less.
nSoldering iron
Basic spec is £ 5sec when 320℃ (±20℃). If temperature is higher, time should be shorter (+10℃à -1sec).
Power dissipation of iron should be smaller than 20W, and temperatures should be controllable .Surface
temperature of the device should be under 350℃.
nRework
1. Customer must finish rework within 5 sec under 340℃.
2. The head of iron cannot touch copper foil
3. Twin-head type is preferred.
n Avoid rubbing or scraping the resin by any object, during high temperature, for example reflow solder etc.
Handling precautions
1.Drive Method
A LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit below.
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 60% RH or less.
2.3 After the package is opened, the products should be used within a week or they should be keeping to store at≦20 R.H. with zip-lock sealed.
3. Baking
It is recommended to baking before soldering when the pack is unsealed after 72hrs. The Conditions are as followings:
3.1 60±3℃ x(12~24hrs) and ＜5%RH, taped reel type
3.2 100±3℃ x (45min~1hr), bulk type
3.3 130±3℃ x (15~30min), bulk type
1608 Series SMD Chip LED Lamps Packaging Specifications
